1. Dual Root System for balanced
performance & higher CPU
to GPU communication
2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
3. 24 DIMMs; up to 6TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM††
4. 8 PCI-E 3.0 x16 slots
(support up to 8 double width GPU),
2 PCI-E 3.0 x8, 1 PCI-E 3.0 x4
5. Up to 24 Hot-swap 2.5" drive bays;
8x 2.5" SATA drives supported
with included H/W, 2x 2.5" NVMe
drives supported with included H/W,
1 NVMe based M.2 SSD
6. 2x 10GBase-T LAN ports via Intel C622
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
Supplies Titanium Level (96%+)
1. Single Root System for excellent
GPU peer to peer communication
with sufficient CPU to GPU throughput
2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
3. 24 DIMMs; up to 6TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM††
4. 11 PCI-E 3.0 x16 (FH, FL) slots
1 PCI-E 3.0 x8 (FH, FL in x16 slot)
5. Up to 24 Hot-swap 2.5" drive bays;
8x 2.5" SATA drives supported
with included H/W, 2x 2.5" NVMe
drives supported with included H/W,
1 NVMe based M.2 SSD
6. 2x 10GBase-T LAN ports via Intel C622
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
Supplies Titanium Level (96%+)
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 24 DIMMs; up to 6TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM††
3. 20 PCI-E 3.0 x16 support
up to 20 single width GPU;
1 PCI-E 3.0 x8 (FH, FL in x16 slot)
4. 24 Hot-swap 3.5" drive bays or
22 Hot-swap 3.5" drive bays +
2 U.2 NVMe 2.5" drives
5. 2x 10GBase-T LAN ports
6. 8 Hot-swap 92mm RPM cooling fans
7. 2000W (2+2) Redundant Power
Supplies Titanium Level (96%+)
Supermicro 1U Passive CPU Heat Sink Socket LGA1150/1155 (SNK-P0049P)
Supermicro 1U Passive CPU Heat Sink Socket LGA3647-0 (SNK-P0067PD)
Supermicro 1U Passive CPU Heat Sink Socket LGA3647-0 (SNK-P0067PSM)